Working principle and application range of UV laser marking machine
Author: zixu Time: 2019/11/23
UV laser marking machine has the characteristics of high performance and ultra precision, which is suitable for high precision marking of precision electronic components, plastics, leather and wood products.
Laser technology in the 1990s with laser technology and optical, crystal and other energy sources for decades of unremitting efforts has successfully developed a UV laser marking equipment, and has attracted extensive international attention.
And took the lead in realizing the application of photovoltaic, glass, film and other industries. With the successful development of UV laser technology, the corresponding solutions have been obtained for the oxidation change of metal surface marking and the active matter of atoms for a long time.
UV laser marking machine belongs to a series of products of laser marking machine, but it is developed with 355nm UV laser. Compared with infrared laser, this machine adopts the third-order intracavity frequency doubling technology, and 355 UV focusing spot is very small, which can greatly reduce the mechanical deformation of materials and has little processing heat effect.
UV laser marking is a kind of cold working. The process of UV laser processing is called "photoresist" effect. The "cold working" has a very high load of energy (UV) photons, which can break the chemical bonds in materials (especially organic materials) or surrounding media, until the materials are destroyed in non thermal process. There is no heating or thermal deformation effect on the inner layer and adjacent area of the machined surface.
UV laser marking machine is mainly based on its unique small power laser beam, which is especially suitable for the high-end market of ultra fine processing. The surface marking of packaging bottles of cosmetics, drugs, food and other polymer materials has fine effect, clear and firm marking, superior to ink printing and pollution-free;
Flexible PCB board marking, scribing; silicon wafer micropore, blind hole processing; LCD LCD two-dimensional code marking, glass surface punching, metal surface coating marking, plastic buttons, electronic components, gifts, communication equipment, building materials, etc.